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  • × 2018 International Conference on Advanced Electronic Materials, Computers and Materials Engineerin
  • × Cryogenic storage
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1 Effect of Cryogenic Storage on Reliability of the BGA Interconnect Solder Joint [会议论文]

作者:Fu, Xing^1,2,3;En, Yunfei^2,3;Ma, Bin^2;等

关键词:Cryogenic storage;Cryogenic temperatures;...

会议举办机构:School of Electronics and Information, South China University of Technology, Guangzhou

会议时间:2018

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